Beijing International Packaging Fair 2012
Category:
Time
Jul 03 at 10:00 AM - Jul 06 at 04:00 PM
(UTC +08:00) Beijing, Perth, Singapore, Hong Kong
Event Summary
Event Admins
Seats available
Unlimited seats
Exhibitor message:
"CHIPF2012 will choose “Better Packaging, More Success” as a theme. The exhibition will focus on packaging design, new packaging materials application, simple packaging concept, packaging recycling and packaging safety. In the meanwhile, CHIPF2012 will continue to inherit the good trend that international exhibitors actively participated in the fair. Besides, it will promotes more exchanges on new technology, equipments, products and visitor-inviting. The fair is a good chance to exchange advanced technologies and also a best platform to show corporate brand image. Therefore, professionals around the world will become the best witness for your new product launch."


